JPS5945325A - 難燃性積層板の製造法 - Google Patents
難燃性積層板の製造法Info
- Publication number
- JPS5945325A JPS5945325A JP15605282A JP15605282A JPS5945325A JP S5945325 A JPS5945325 A JP S5945325A JP 15605282 A JP15605282 A JP 15605282A JP 15605282 A JP15605282 A JP 15605282A JP S5945325 A JPS5945325 A JP S5945325A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- epoxy resin
- varnish
- equivalent
- laminated sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims description 4
- 239000003063 flame retardant Substances 0.000 title claims description 4
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000004593 Epoxy Substances 0.000 claims abstract description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- 239000002966 varnish Substances 0.000 claims abstract description 12
- 239000011888 foil Substances 0.000 claims abstract description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 241000380131 Ammophila arenaria Species 0.000 claims 1
- 229930185605 Bisphenol Natural products 0.000 claims 1
- 101100420946 Caenorhabditis elegans sea-2 gene Proteins 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920003986 novolac Polymers 0.000 claims 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 3
- 229930003836 cresol Natural products 0.000 abstract description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 abstract description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 3
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004744 fabric Substances 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract 2
- 230000003014 reinforcing effect Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 238000007731 hot pressing Methods 0.000 abstract 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- -1 sulfoxy Chemical group 0.000 description 2
- WDKYDMULARNCIS-GQCTYLIASA-N Caffeic acid ethyl ester Chemical compound CCOC(=O)\C=C\C1=CC=C(O)C(O)=C1 WDKYDMULARNCIS-GQCTYLIASA-N 0.000 description 1
- 208000006558 Dental Calculus Diseases 0.000 description 1
- 241000238631 Hexapoda Species 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000010310 bacterial transformation Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 210000000554 iris Anatomy 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Substances OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 235000021395 porridge Nutrition 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000035935 pregnancy Effects 0.000 description 1
- ROSDSFDQCJNGOL-UHFFFAOYSA-N protonated dimethyl amine Natural products CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15605282A JPS5945325A (ja) | 1982-09-08 | 1982-09-08 | 難燃性積層板の製造法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15605282A JPS5945325A (ja) | 1982-09-08 | 1982-09-08 | 難燃性積層板の製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5945325A true JPS5945325A (ja) | 1984-03-14 |
JPS6341937B2 JPS6341937B2 (en]) | 1988-08-19 |
Family
ID=15619257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15605282A Granted JPS5945325A (ja) | 1982-09-08 | 1982-09-08 | 難燃性積層板の製造法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5945325A (en]) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61124309A (ja) * | 1984-11-19 | 1986-06-12 | 三菱農機株式会社 | 農作業機における機体昇降装置 |
JPS61138621A (ja) * | 1984-12-11 | 1986-06-26 | Sumitomo Bakelite Co Ltd | エポキシ樹脂積層板の製造方法 |
JPH0220546A (ja) * | 1988-07-08 | 1990-01-24 | Mitsubishi Kasei Corp | 繊維強化プラスチック用樹脂組成物 |
-
1982
- 1982-09-08 JP JP15605282A patent/JPS5945325A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61124309A (ja) * | 1984-11-19 | 1986-06-12 | 三菱農機株式会社 | 農作業機における機体昇降装置 |
JPS61138621A (ja) * | 1984-12-11 | 1986-06-26 | Sumitomo Bakelite Co Ltd | エポキシ樹脂積層板の製造方法 |
JPH0220546A (ja) * | 1988-07-08 | 1990-01-24 | Mitsubishi Kasei Corp | 繊維強化プラスチック用樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
JPS6341937B2 (en]) | 1988-08-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3280409T3 (de) | Mehrschichtige gedruckte Leiterplatte und Verfahren zu ihrer Herstellung. | |
DE69122919T2 (de) | Metallfolienbedeckte Schichtstoffe mit einer glatten Oberfläche | |
DE10333250A1 (de) | Prepreg und Laminat | |
KR20000036164A (ko) | 에폭시수지 조성물과 헤테로가교제로 구성된 말레산 무수물 및 스티렌의 공중합체 | |
WO2007057311A1 (en) | Flame retardant prepregs and laminates for printed circuit boards | |
JPS5945325A (ja) | 難燃性積層板の製造法 | |
DE2039170C3 (de) | Haftvermittler zwischen anorganischen Feststoffen und organischen Harzen | |
DE2033626B2 (de) | Verfahren zur Herstellung von Pregregs | |
DE68914150T2 (de) | Polyimid-harz. | |
DE2934613C2 (de) | Verfahren zur Herstellung von hitzehärtbaren Vorpolymerisaten vom Maleinimidtyp | |
JPS5889614A (ja) | 難燃性積層板の製造法 | |
DE68926073T2 (de) | Harzzusammensetzung für Laminate | |
DE2924718A1 (de) | Polyglycidylaether und ein zweiwertiges phenol enthaltende mischung sowie deren verwendung zur herstellung von kunststoffen | |
DE2038275B2 (de) | Polyimide aus 2,6-Diamino-striazinen und Dianhydriden | |
JPH0149301B2 (en]) | ||
EP0493414A1 (en) | POLYIMIDE RESIN LAMINATES. | |
JPH01139629A (ja) | 低誘電率熱硬化性樹脂積層板の製造方法 | |
JPH04356521A (ja) | エポキシ樹脂組成物 | |
DE4125420A1 (de) | Elektrisch hochwertige bindemittel zur herstellung von basismaterial fuer leiterplatten | |
JPS60187537A (ja) | エポキシ樹脂積層板の製造法 | |
DE1933880C3 (de) | Verfahren zur Herstellung von Imidgruppen aufweisenden Polykondensaten | |
JPS62207643A (ja) | ガラス/不飽和ポリエステル積層板及びその製造方法 | |
JPH04356520A (ja) | エポキシ樹脂組成物、そのプリプレグ、及びその積層板 | |
JPS59223713A (ja) | 積層板用植物油変性フエノ−ル樹脂の製造法 | |
JPH0192238A (ja) | エポキシ樹脂積層板の製造方法 |